Advanced Substrate Design: Material Migration Strategies from Ceramics to Organic and Laminates

Session details:

The semiconductor packaging industry is shifting from traditional ceramic substrates to advanced organic materials and laminate structures driven by performance demands and cost pressures. This presentation examines technical and economic considerations for migrating substrate technologies while maintaining fit, form, and function requirements. We explore trade-offs in performance, electrical characteristics, mechanical reliability, and manufacturing scalability across ceramic, organic, and laminate substrates. Key topics include material property comparisons, design rule adaptations for form factor preservation, and qualification approaches for high-reliability military and aerospace applications. Proposals demonstrate successful ceramic-to-organic conversions meeting stringent performance specifications while reducing cost and improving supply chain flexibility. This analysis provides practical guidance for engineers evaluating substrate technology transitions in defense and aerospace electronic systems.